Core Technical Specifications
- Product Name: RELIFE RL-601L Plus Mobile Phone Special-Shaped Motherboard Repair Fixture
- Dimensions: 153 × 80 × 19 mm
- Net Weight: ~265 grams
- Base Material: High-density alloy steel
- Top Material: High-temperature synthetic stone
Key Features & Design
- Special-Shaped Motherboard Adaptability: Features multiple misaligned, multi-step card slots and structural V-grooves. This design allows it to securely clamp traditional rectangular boards as well as complex L-shaped or staggered modern smartphone motherboards without slipping.
- Two-Way Precise Clamping: Utilizes an adjustable dual-slot slide rail design equipped with precision step slide buckles, allowing technicians to work on multiple components or boards simultaneously.
- Spring Push-Rod Mechanism: Ensures fast, one-step locking. The internal spring tension provides a firm grip that prevents the board from flexing or warping under heat, without putting crushing pressure on delicate PCB layers.
- Thermal Management: The top surface integrates synthetic stone plate segments built with chip heat-dissipation holes. This prevents localized heat buildup during intense BGA rework, protects neighboring components, and resists high temperatures up to 105°C without emitting toxic fumes.
- Heavy, Non-Slip Base: Built on a solid alloy steel foundation, providing the weight needed to stay firmly planted on a silicone microscope mat during scraping, glue removal, or fine wire jumping.
Primary Applications
- Motherboard Soldering: Stabilizes logic boards during micro-soldering, trace jumps, and connector replacements.
- BGA Reballing & IC Rework: Holds CPU, NAND, and power IC chips securely for reballing or cleaning.
- Chip Glue/Residue Removal: Gives the physical leverage needed to safely scrape off underfill or black glue from around critical ICs without the board moving.
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