Key Specifications & Features
- Core Purpose: Engineered for automatic, high-precision alignment during mobile CPU reballing (tin planting) and glue removal tasks.
- Magnetic Power Alignment: Equipped with an embedded high-temperature magnet. This provides powerful magnetic adsorption that securely locks the logic board stencils onto the platform, completely preventing offset or slipping during soldering.
- Universal Chip Structure: Built with an adjustable internal slot design. Simply secure the chip into the upper-left corner of the slot, allowing the auto-clamping magnetic modules to grasp the chip’s edges firmly.
- Premium Material Construction: The body is molded from heavy-duty, high-strength synthetic stone. It is highly resistant to extreme temperatures, repels dirt, avoids static buildup, and features anti-skid base properties to keep your workspace stable.
- Apple CPU Compatibility: Specifically tailored for Apple’s architecture, matching motherboard chips from the A11 through the A19 Pro series.
Included Stencil Plates
The platform interacts seamlessly with ultra-thin (0.12mm) premium steel mesh stencils. The exact stencils provided in this particular edition are:
- Standard Series: A11, A12, A13, A14, A15, A16, A17, and A19.
- Pro Series: A18 Pro and A19 Pro.
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