Key Features
- High-Purity Copper Material: Manufactured from precision-braided pure copper, which maximizes thermal conductivity and provides continuous flexibility.
- Fast Solder Absorption: Rapidly melts and pulls away residual solder from pads to streamline the cleaning process.
- Low Residue Formula: Engineered to minimize residue on the board after desoldering, saving you post-cleanup time.
- Micro-Passivation Process: Includes an anti-oxidation treatment that helps protect fragile solder pads and prevents unnecessary damage to the board.
- Precision Targeting: Ideal for fine component repair, including BGA, QFP, 0201 packages, and phone repairs.
Specifications
- Width: 2.0 mm (The “2015” designation denotes its width and length variant, whereas the companion R1515 model is 1.5 mm wide).
- Length: 1.5 meters per spool.
- Packaging: Often distributed in packs of 10 or sold as individual spools depending on the retailer.
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