Key Features & Specifications
- High-Density Nano Adsorption: Features nanoscale physical adsorption that lifts stubborn contaminants like rosin flux, grease, and dust cleanly away from pads and components.
- 3× Compressed Foam: Provides enhanced structural durability so the sponge won’t easily shred or disintegrate when rubbed against sharp solder joints or micro-components.
- Safe for Precision Electronics: Cleans effectively without damaging surface-mount pads, trace lines, or sensitive glass coatings.
- Miniature Form Factor: The small ball shape allows it to easily penetrate tightly packed crevices on a motherboard.
- Package Volume: Typically sold in bulk packs containing 500 pieces per box.




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