Key Product Features
- High and Low-Level Design: It features an industry-pioneering multi-level design that accommodates thicker components like USB ports or screen buttons, preventing the PCB from wobbling or sitting unevenly.
- Carbon Fiber Plate: The base is constructed from premium carbon fiber, offering exceptional high-temperature resistance, excellent corrosion protection, low density, and high strength.
- 3-Axis Clamping: Utilizes a bidirectional, spiral hinge mechanism with three distinct clamping ports to fast-position standard and special-shaped mobile motherboards safely without crushing delicate chips.
- Precise Alignment: Eliminates minor shaking that can otherwise ruin high-precision BGA chip reballing or micro-soldering tasks under a microscope.
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