Core Specifications & Functions
- Component Type: Power Supply Management / Main Charging IC.
- Package Form: Ball Grid Array (BGA) package requiring professional micro-soldering tools to replace.
- Functionality: It distributes and regulates voltage from the battery source to the CPU, audio, and other critical circuitry across the device’s motherboard.
Common Symptoms of Failure
If this component is faulty, the device usually experiences the following hardware issues:
- Failure to power on completely (Dead motherboard).
- Unstable voltage delivery or fast battery drain.
- Complete charging failure or slow charging.
Device Compatibility List
The S2MPU03A chip is widely used across these specific smartphone lines:
- Samsung Galaxy J7 Series (2015): Models including J700F, J700H, J700M, J7008, J700T, and J700P.
- Samsung Galaxy A Series (2016): Galaxy A3 (A310F/Y/M/N), Galaxy A5 (A510F/M/0/Y), and Galaxy A7 (A710F/0/M/Y).
- Samsung Galaxy J6 / J6 Plus: Select regional variants.
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