Key Technical Specifications
- Brand/Model: 2UUL Official Catalog SC17 “Mr. Flux 01”.
- Net Capacity: 10ml (10cc) volume housed in a syringe-style dispenser.
- Material Integrity: Acid-free, halogen-free, and non-corrosive.
- Physical Profile: Thick, highly viscous liquid designed to reduce component shifting during heat application.
- Weight Profile: 23g net weight; 39g gross packaging weight.
Core Functional Advantages
- Non-Displacement Characteristics: The viscous nature of the paste acts as a stabilizing agent. It actively prevents small SMD chips and BGA ball arrays from drifting out of alignment when hit with a hot air rework station.
- True No-Clean Formula: It minimizes work steps because the residue left behind post-heating is clear, chemically inert, non-conductive, and structurally non-corrosive. This safely eliminates the requirement for chemical ultrasonic baths or manual isopropyl alcohol scrubbing.
- Enhanced Wetting Properties: It features excellent surface tension reduction (wettability), enabling solder alloys to flow evenly across pads to form solid, shiny, and structurally secure joints.
- Anti-Oxidation Barrier: De-oxidizes copper traces dynamically while shielding molten solder pools from environmental oxygen during high-temperature cycles.
Common Industry Applications
- BGA Reballing Operations: Securing solder spheres onto chip substrates during high-precision reballing grids.
- IC & Processor Replacements: Safely conducting reflow profiles on sensitive CPU or baseband components without heat-induced structural shifts.
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