Key Specifications & Features
- Material: High-toughness, ultra-clear toughened glass.
- Dimensions: Typically 20mm × 20mm × 1mm per glass pad.
- Anti-Explosion & Anti-Splash: Prevents solder paste from splattering or exploding during heat application.
- Flat Pressure Application: Holds the BGA stencil completely flat to prevent it from bulging or warping when heated. This blocks air gaps and ensures uniform, clean solder ball coverage.
- High Heat & Impact Resistance: Withstands extreme temperatures directly from a hot air rework blower without cracking, shifting, or breaking.
Overview of the Kit
The set comes packed inside a compact, clear plastic storage case that protects the five transparent glass pieces when they are not being used for micro-soldering
Reviews
There are no reviews yet.