Key Specifications & Product Features
- Kit Components: The package contains 4 ultra-thin metal blades featuring distinct double-sided geometries alongside 1 triangular plastic pry tool (guitar pick) used safely to leverage outer casings without scratching internal boards. [1]
- Physical Profile: Crafted using flexible, high-tensile alloy steel engineered to resist deformation at elevated temperatures when working alongside hot air rework stations
- Ultra-Thin Edge Detail: These tips feature razor-thin tapering to sneak directly underneath tightly spaced components like the CPU, NAND flash memory, and baseband chips on Apple iPhone and Android mainboards.
- Anti-Stick Treatment: Specialized smooth metallic finishes minimize the tendency for melted solder or flux paste to firmly adhere to the metal tips while pulling chips.
Common Applications
- Underfill & Resin Scraping: Removing hard epoxy, black glue, or UV masking resins that tightly secure chips down to the logic board substrate
- CPU & BGA Desoldering: Sliding beneath large ball grid array components during hot-air reflow to pry them off cleanly without ripping delicate copper traces or solder pads underneath.
- General Frame & Screen Separation: Using the flat scraper variants to clear residual adhesive or carefully cut through tape under screens and glass back-covers.
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