Core Architecture
- Manufacturer: Qualcomm Technologies, Inc. (QTI)
- Part Number / Package: WCD-9370-0-WLPSP55-TR-01-0 (55-pin Wafer-Level Chip-Scale Package)
- Process Technology: 40 nm codec geometry, optimized for a smaller physical footprint and reduced production cost.
- Primary Interface: MIPI SoundWire standard interface for communicating with the host processor and mapping all on-chip digital audio channels.
Audio Converter & Port Specifications
- Data Converters: Integrated with 2 Audio Analog-to-Digital Converters (ADCs) and 4 Digital-to-Analog Converters (DACs).
- Input (Tx) Ports: 3 analog input channels supporting hardware routing for components like the Primary Microphone and Secondary/Noise-Cancelling Microphone.
- Output (Rx) Ports: 4 analog output channels designed to drive onboard acoustic hardware.
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