Technical Specifications
- Manufacturer: Winbond Electronics Corporation
- Part Number: W25Q256JVEQ / 25Q256JVEQ
- Memory Capacity: 256 Megabit (Mb) / 32 Megabyte (MB) [Chipset Elektronik]
- Interface Type: Serial NOR Flash with Dual/Quad SPI [Bilal GSM]
- Package Type: WSON-8 (8-pad, 8×6 mm surface mount package with an exposed center thermal pad) [Bilal GSM]
- Application: Widely used for storing BIOS/firmware in smartphones, laptops, networking equipment, and embedded hardware platforms during board repairs [Bilal GSM].





Reviews
There are no reviews yet.