Core Specifications
- Alloy Composition: 63% Tin / 37% Lead (Sn63/Pb37)
- Melting Point: Exactly 183°C (361°F)
- Particle Size: 25–45 microns (Type 3 / Type 4 powder)
- Volume/Weight: Typically packaged as a 10cc syringe or small tub weighing approximately 35 grams.
- Flux Classification: High-viscosity, “no-clean” rosin-based flux formula.
Key Benefits & Performance
- Strong Wetting Action: The paste exhibits excellent dry resistance and wets perfectly to copper and components, creating shiny, structurally full joints without dry or false soldering flaws.
- Anti-Beading Formula: When heated via hot air gun or reflow oven, it melts cleanly without spitting or creating stray tin beads or solder bridges.
- Clear Residue: The integrated flux leaves behind a minimal, clear-to-pale-yellow residue that does not interfere with electrical testing. While it is classified as “no-clean,” any visual excess can be easily wiped away using isopropyl alcohol (IPA).
- Long Stencil Life: It maintains its wet texture for hours at room temperature, making it ideal for continuous application via stencils or mechanized manual plungers.
Target Applications
- Mobile & Computer Rework: Soldering micro-components on smartphone motherboards and computer logic boards.
- BGA Reballing: Repairing or replacing integrated chipsets by aligning the micro-paste with precision stencils.
- SMD/SMT Assembly: Soldering surface-mount diodes, resistors, capacitors, and dense multi-pin chips.
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