Core Technical Specifications
- Melting Point: 150°C (Low-temperature formula safely protects sensitive components from thermal damage).
- Composition: Enhanced with silver (Ag) particles for superior wetting and strong mechanical bonds.
- Common Packaging: Available in 50g jars/tubes or convenient 35g syringes for direct manual application.
- Viscosity: Formulated to stay stable without collapsing or causing component shifting during reflow.
Key Benefits & Use Cases
- Component Safety: Ideal for multi-layered logic boards (like iPhones or Android devices) where overheating neighboring components or underfilled chips must be avoided.
- Reduced Rework: Added silver ensures bright, full solder joints that resist cracking.
- Ease of Use: It performs excellently with BGA stencils, forming perfect, uniform tin spheres instantly under a hot air gun.
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