Key Specifications & Features
- Melting Point: 183°C, which is the standard medium-temperature point ideal for structural components that require higher heat resistance than low-temp pastes (like 138°C) but less thermal stress than high-temp profiles.
- Conductivity Boost: The formula includes added silver particles, which dramatically lower the risk of false or virtual soldering while improving overall signal and power conductivity
- Viscosity & Anti-Collapse: Engineered with strong adhesion parameters to prevent chip offset or paste collapse during hot air reflow.
- Cleanliness: Formulated for minimal, non-corrosive residue, meaning it rarely requires intensive cleaning post-reflow.
Primary Applications
- Mobile Motherboard Repair: Highly recommended for iPhone and Android logic board repairs, including CPU, PMIC, and baseband IC replacements.
- BGA Reballing / Tin Planting: Spreads smoothly into stencils for uniform, full solder balls.
- SMT/SMD Patching: Used for precise precision component placement on dense printed circuit boards (PCBs).
Product Options
- YCS 183°C Syringe Solder Paste: Ideal for precise manual dispensing through fine needles directly onto pads.
- YCS 183°C Jar/Pot (50g/60g): Best for bulk stencil scraping and reballing applications.
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