Key Technical Specifications
- Brand/Model: YCS-2015.
- Line Width: 2.0 mm (ideal for mobile motherboard repair, SMD/SMT components, and BGA reballing).
- Line Length: 1.5 meters per individual spool.
- Packaging: Typically distributed in a protective moisture-proof PET jar containing a set of 5 individual spools.
Core Material Performance
- Pure Copper Weave: Constructed from ultra-fine strands of pure copper woven together tightly. This architecture maximizes surface area and optimizes capillary action to seamlessly draw molten solder away from the board.
- Rosin Flux Core: Infused with high-quality, low-residue flux that lowers the surface tension of the solder, accelerating heat transfer and tin absorption.
- Thermal Protection: Offers rapid thermal conductivity to reduce the duration of heat application, actively safeguarding sensitive underlying circuit components from thermal stress or damage.
Step-by-Step Instructions for Effective Use
- Position the Braid: Place the unreeled tip of the desoldering wick directly over the specific solder joint or component pad you intend to clean.
- Apply Heat: Position your heated soldering iron tip at an angle over the braid, pressing gently. The angle ensures maximal contact area and immediate thermal transmission through the copper weave.
- Absorb Solder: Hold the iron in place for a few brief seconds. As the heat transfers down, you will see the silver solder liquefy and rapidly wick up into the copper fibers.
- Remove Concurrently: Always lift the soldering iron and the braided wire away from the PCB simultaneously to prevent the cooled wick from bonding directly to the circuit trace.
- Trim Used Section: Snip off the spent, solder-saturated segment of the wick using flush cutters before moving on to the next joint.
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