Key Features & Specifications
- No-Clean Formula: It leaves virtually clear, non-corrosive residue after heating, eliminating the need for post-solder cleaning or chemical rework.
- High Insulation: The formula is strictly non-conductive, protecting delicate PCB circuits from short circuits and electrical interference.
- Halogen-Free & Safe: It is halogen-free, reducing toxic fumes and ensuring compatibility with sensitive modern electronics.
- High Temperature Resistance: Features a high-temperature drop point that ensures even heat distribution and prevents component oxidation during heavy rework.
- Smooth Creep Performance: Spreads smoothly and evenly across the joints to promote excellent wetting, eliminating cold solder joints.
Packaging Options
The flux paste typically comes in easy-to-use extrusion bottles or syringe tubes to control usage amounts efficiently:
- 5CC / 5ml squeeze bottles
- 10CC / 10ml syringes (often bundled with a plunger and blunt needle)
- 15ml squeeze containers
Primary Applications
- Mobile Repair: iPhone/Android motherboard repairs.
- Micro-Soldering: Soldering fine-pitch components like CPU, NAND, Baseband, and PMIC chips.
- BGA Reballing: Provides a tacky surface to hold and seat micro solder balls onto chip arrays perfectly.
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