Core Technical Specs & Design
- Primary Function: It stabilizes BGA (Ball Grid Array) stencils and chips firmly in place via strong embedded magnetic adsorption, eliminating part shifting or alignment errors during the tin-planting/reballing phase.
- Thermal Endurance: Made from soft, highly flexible, high-temperature resistant synthetic silicone rubber. It withstands the direct blast of electronics hot air rework stations without melting or buckling.
- Hollow Heat Sinks: The reverse side features hollowed ventilation holes. This promotes immediate heat dissipation during soldering, keeping the underlying steel stencils flat and preventing them from expanding or warping under high temperatures.
- Physical Dimensions: It spans roughly 100mm × 80mm (approximately 3.93 × 3.14 inches) with integrated recessed slots marked by thickness indicators like 0.77, 0.45, and 0.3 for managing matching components.
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